menu 1
Line Card
Release Films
Press Pads
Conformals
Contamination
MSDS's
menu 8
Technical Help Desk
menu 10
 
HOME
|
ABOUT US
|
PRODUCTS
|
LAY-UPS
|
PROCESS SOLUTIONS
|
IN THE NEWS
|
CONTACT US
|
LINKS
|
SITE MAP
 

P R O C E S S   S O L U T I O N S   F O R   S C R A P   R E D U C T I O N
 
Introduction

PACOTHANE TECHNOLOGIES employs specialists in engineering, manufacturing, and polymer chemistry. This team works hand-in-hand with our customer support staff to aggressively address the ever changing needs of PCB manufacturers.

The following is a sampling of the production challenges that our Clients encounter and the successful Pacothane product solutions. Our expert Team welcomes your challenge and looks forward to supporting the success of your enterprise. Please contact us for information or support.
 
PROCESS
PROBLEM
CAUSE
SOLUTION
 
Rigid Multilayer Lamination
  • Surface Defects in Copper Foil (Pits & Dents)
Damaged (dented, scratched) Separator Plates and Airborne Debris
 PACOTHANE
 
 
  • Wrinkled Or Wavy Copper
 Excessive Shrinkage of Release film. Release film shrinkage draws the copper foil in, causing wrinkles. PACOTHANE
   
  • Internal Mis-Registration
 Uneven Pressure Distribution across the panel surface.
 PACOPADS
 
   
  • Localized Resin Starvation (Edge Frosting)
 Excessive localized resin flow caused by extreme pressure imbalances across the panel surface. PACOPADS
 
   
  • Thickness Variation (Uncontrolled Resin Flow)
 Variations in panel thickness due to uneven resin flow caused by inconsistent book heat rise. PACOPADS
 
   
  • Thickness Variation (Pressure Imbalance)
 Center-to-edge thickness variation caused by excessive resin flow due to pressure imbalances. PACOPADS
 
   
  • Voiding In Low Pressure Areas
 Entrapped air/volatiles (voids) is caused by non-uniform and insufficient hydraulic pressure to push the air/volatiles out of the critical board area. PACOPADS
 
 
 Back to top
  • Image/Glass Cloth Texture
 Areas where the glass cloth is visible due to pressure imbalances. PACOPADS
 
 
Flexible Circuit Lamination
  • Entrapped Air
 Failure of the make-up materials to provide close conformity to the part topography. "PACO PLUS"
System
 
 
  • Adhesive Bleed Into Open Areas
Failure of conventional make-up materials to provide adequate conformity to flexible circuit board topography. "PACO PLUS" System

"PACOFLEX" System
   
   
  • Internal Mis-Registration (Flex Multilayer)
 Unequal pressure distribution across the panel surface.
 "PACO PLUS" System
 
Contamination
  • Shorts/Opens
 Dirt and debris leading to shorts and opens.
 PACO•KLEEN
 
 
  • Surface Defects in Copper Foil (Pits & Dents)
 Dirt and debris adhered to the panel surface prior to lamination. PACO•KLEEN
   
   
  • False Alarms [Unclean Panel]
 Dirt and debris adhered to the panel surface causing alarms at AIO. PACO•KLEEN
   
   
  • False Alarms [Handling Damage]
 Paper fiber and air-born contamination; minor scratched and trace imperfections, due to Handling Damage, causing alarms at AOI. PACOGARD
   
   
  • Poor Photoresist Adhesion
Oxidized Copper surface results in an unstable bond to the photoresist. PACOGARD
   
   
  • Surface Defects in Solder Mask
 Scratches, chips and blemishes on cured Solder mask.
 PACOGARD
 
Back to top
   
 

Tel: 413-534-7800   Fax: 413-535-2123
info@pacothane.com
Pacothane Technologies, 3 Valley Mill Road,
Holyoke, MA 01040
A Division of Multilayer Worldwide Enterprises LLC.
© Copyright 2006, Pacothane Technologies, All rights reserved.