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Phone: 781-729-0927      Fax: 781-729-0929      
Blue Circuit Board

PROCESS SOLUTIONS:

Rigid Multilayer Lamination

"I want the smoothest surface possible without Any image transfer from my Release film used."

CAUSED BY: Texture from surface condition of the release film.

SOLUTION: PACOTHANE® HT 1500 SMOOTH

"I need a consistent residue free release film that offers low extraction values."

CAUSED BY: Manufacturing process of the release coating and base Film used.

SOLUTION: PACOTHANE® LE 2000

Wrinkled or Wavy Copper

CAUSED BY: Excessive Shrinkage of Release film. Release film shrinkage draws the copper foil in, causing wrinkles.

SOLUTION: PACOTHANE® HT 1500

Internal Mis-Registration

CAUSED BY: Uneven Pressure Distribution across the panel surface.

SOLUTION: PACOPADS™

Localized Resin Starvation (Edge Frosting)

CAUSED BY: Excessive localized resin flow caused by extreme pressure imbalances across the panel surface.

SOLUTION: PACOPADS™

Thickness Variation (Uncontrolled resin flow)

CAUSED BY: Variations in panel thickness due to uneven resin flow caused by inconsistent book heat rise.

SOLUTION: PACOPADS™

Thickness Variation (Pressure Imbalance)

CAUSED BY: Center-to-edge thickness variation caused by excessive resin flow due to pressure imbalances.

SOLUTION: PACOPADS™

Voiding in Low Pressure areas

CAUSED BY: Entrapped air/volatiles (voids) is caused by non-uniform and insufficient hydraulic pressure to push the air/volatiles out of the critical board area.

SOLUTION: PACOPADS™

Image/Glass Cloth Texture

CAUSED BY: Areas where the glass cloth is visible due to pressure imbalances.

SOLUTION: PACOPADS™



Flexible Circuit Lamination

Entrapped Air

CAUSED BY: Failure of the make-up materials to provide close conformity to the part topography.

SOLUTION: PACOTHANE® PLUS

Adhesive Bleed Into Open Areas

CAUSED BY: Failure of conventional make-up materials to provide adequate conformity to flexible circuit board topography.

SOLUTION: PACOTHANE® PLUS, PACOFLEX™ ULTRA

Adhesive Bleed into tight Tolerance areas with LOW profile topography.

CAUSED BY: Failure of conventional make-up materials to Provide adequate conformity to flexible circuit board topography.

SOLUTION: PACOFLEX™ ULTRA

Adhesive Bleed into tight Tolerance areas with HIGH profile topography.

CAUSED BY: Failure of conventional make-up materials to Provide adequate conformity to flexible circuit board topography.

SOLUTION: PACOTHANE® PLUS, PACOFLEX™ 10000

Internal Mis-registration (Flex Multilayer)

CAUSED BY: Unequal pressure distribution across the panel surface.

SOLUTION: PACOPADS™ & PACOTHANE® PLUS, PACOFLEX™ ULTRA, PACOFLEX™ 10000 for macro and micro Z-axis pressure distribution.



Contamination

False Alarms [Handling Damage]

CAUSED BY: Paper fiber and air-born contamination; minor scratched and trace imperfections, due to Handling Damage, causing alarms at AOI.

SOLUTION: PACOGARD™

Poor Photoresist Adhesion

CAUSED BY: Oxidized Copper surface results in an unstable bond to the photoresist.

SOLUTION: PACOGARD™

Surface Defects in Solder Mask

CAUSED BY: Scratches, chips and blemishes on cured Solder mask.

SOLUTION: PACOGARD™

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