PACOPADS are a line of press pads specifically engineered to improve the process of laminating rigid multi-layer and flexible Printed Circuit Boards. They serve two primary functions: to accurately Control heat input and to Equalize the pressure applied to the panel surface.

• Control of Heat Rise
  PACOPADS perform this function with totally predictable and reproducible results due to their uniform fiber distribution and tightly controlled thickness and weight specifications.
• Equalization of Pressure Throughout the Pressure Load
  Use of PACOPADS eliminates air voids, inner-layer slippage and White corners or edges. PACOPADS also reduce dielectric thickness variations, image and glass cloth transfer, and obviate the potential of low-pressure prepreg blisters.
• 3-Dimensional Conformance
  PACOPADS eliminate X-Y-Z axis stress which cause Cover-layer voids and circuit distortion. At the same time, PACOPADS improve cavity fill, and adhesive flow control in the manufacture of Flex, Rigid-flex, and Heat Sink Circuit Boards.

• Proven worldwide performance since 1986.
• Operating temperature of 475°F/246°C for six hours.
• Three standard thicknesses of .035" (.89mm), .055" (1.4mm), and .085" (2.2mm) for custom Heat Input Control and optimal Pressure Equalization.
• Extremely low moisture to reduce liquid buildup in vacuum systems.
• Uniform fiber formation and distribution for unmatched pressure equalization, micro Z-axis conformance and repeatable, consistent Heat Rise.
• Low fiber dusting and contamination.
• No resinous binders or fillers, essentially sulfur free, with no odor or solvents to pollute vacuum systems or the work environment.
• Environmentally friendly – suitable for re-pulping, land fill disposal or incineration.