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Ultra High Temperature Release Film |
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Overview
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For
Lamination of Rigid Multilayer and Flexible Circuits PACOLON is a line of ultra high performance Release Films with grades that withstand operating temperatures up to 500°F/260°C. PACOLON films are engineered to provide excellent, contamination-free release during the process of laminating Rigid Polyimide PCBs, all Flexible Circuit Boards, Teflon and other demanding applications. These films provide a super smooth surface for adhesive and resin flow control [Flex Circuits], with low deformation under pressure [i.e., controlled, repeatable shrinkage]. |
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PACOLON,
an advanced-polymer Release Film, is available in thicknesses from 0.001"
to 0.005" (25µ to 125µ). It is engineered to withstand
operating temperatures up to 500°F / 260°C for four hours. PACOLON
will provide easy and clean release without leaving plate or panel residue. |
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PACOLON Release
Film is available in rolls and in custom-made sheet sizes, tooled to customers
specifications. PACOLON, as well as the complete line of lamination enhancement
products listed below, is available from leading local distributors around
the world who offer Just-in-time delivery from locally-available
stocks. |
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Click here to view a printable version of the PACOLON Material Safety Data Sheet. Back to top |
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Tel: 413-534-7800 Fax: 413-535-2123 info@pacothane.com Pacothane Technologies, 3 Valley Mill Road, Holyoke, MA 01040 A Division of Multilayer Worldwide Enterprises LLC. © Copyright 2006, Pacothane Technologies, All rights reserved. |