For the Lamination of Coverlays & Flexible PCBs

PacoFlex™ #5000 is specifically engineered for the Lamination of Cover-Layers to Flexible Printed Circuit Boards. This product is a highly Conformable Release Film which, when exposed to heat and pressure, becomes extremely soft and pliable for superior conformance to intricate flex part topographies. The soft, heat-activatable, Hydraulic center is application-designed to reduce excessive "squeeze-out" and, effectively blocks adhesive or resin flow into unwanted areas.

• Total Elimination of Entrapped Air Between the Cover-Layer and the Circuitized Base Laminate.
• PacoFlex delivers discreet hydraulic force to reliably drive the Cover-Layer into complete side-wall conformance with the Circuitized Base Laminate.
• Finite Control of Adhesive Flow.
• Due to the optimized surface, and superior conformability, PacoFlex dams back acrylic and epoxy adhesives from flowing into Cover-Layer clearance areas.
• Quick, Easy Release.
• Both Sides of PacoFlex provide quick, easy, non-residue Release from all surfaces.
• Reduces Mechanical Distortion.
• PacoFlex "locks-in" around the Flexible components to minimize distortion due to Heat and Pressure.
• PacoFlex conforms closely to the part surface without excessive flow-out from the sheet. Deformed Circuits, Crushed Pads, and Glossy Pressure Spots are eliminated, resulting in repeatable Pad Registration.
• Reduced Lamination Pressure.
• PacoFlex, used with PacoPress® Pressure Diffuser Pads, delivers unmatched Z-axis pressure equalization. These two companion products conform and stabilize the Flexible components allowing the user to reduce the Hydraulic Force by up to 30%.