Pacothane Technologies LLC announces the introduction of a technologically
advanced, totally new Conformable Release Film that is specifically
engineered to dramatically improve production yields and to simplify
and standardize the process of laminating Cover-Layers to Flexible
Printed Circuit Boards. PACOFLEX 5000, the trade-marked name for
this product, has been thoroughly field-tested and has been proven
to control and eliminate reworks or rejections due to the common
problems of excessive adhesive flow into unwanted areas, crushed
pads, air-entrapment between spaces and lines, high levels of distortion
and misregistration, discoloration and other factors that generate
scrap.
During
the laminating cycle, PACOFLEX 5000 is engineered to become soft
and pliable in the “Z -Axis” to achieve superior
sidewall conformance with the circuitized base Laminate and to
promote micro conformity of Coverlay to other intricate flex part
topographies. PACOFLEX’S optimized surface rugosity features
non-contaminating release on both sides of the proprietary film
which will not leave a residue on the laminated substrate it is
contact with. Finally, PACOFLEX Conformal Films dam back acrylic
and epoxy adhesives as required and reduces excessive “squeeze
out” or resin flow into Cover-Layer clearance areas, enabling
product users to consistently meet Mil-P 50884 and IPC-6013 Specifications.
Martin
J. Wilheim, CEO & Chairman of Pacothane Technologies,
states, “Until now the Flexible Circuit industry has had
to adapt their manufacturing processes to the implications of using
a two-component conformable release film. PACOFLEX 5000, as a single-component,
Conformable Release Film controls Adhesive flow better and provides
repeatable results to minimize and eliminate the need for costly
re-works.” Wilheim further adds, “Because PACOFLEX
performs efficiently and effectively at significantly lower pressures
and temperatures than any other conformable system, there is noticeably
less distortion within the Coverlayer Package.”
PACOFLEX
5000 Is a high temperature processing tool and has extremely
low “X-Y Axis” movement while offering significant
micro “Z-Axis” control to obtain sidewall conformance
and eliminate entrapped air between the Cover-layer and the circuitized
base Laminate, thereby increasing production yields tremendously.
PACOFLEX 5000 is also clean and inert with no out-gassing of contaminants
or solvents harmful to Vacuum Lamination systems. It is easily
disposable.
The
ideal “PACOFLEX Lay-up System” should always
include a pressure-equalizing PACOPADS® Soft-Lamination Press
Pad to achieve incomparable micro and macro “Z-Axis” pressure
equalization. These two companion products conform and stabilize
the Flexible components to achieve all of the positive attributes
of PACOFLEX to help the end user achieve lower costs and increased
yields.
