For the Lamination of Coverlays & Flexible PCBs

PacoFlex™ #5000 is specifically engineered for the Lamination of Cover-Layers to Flexible Printed Circuit Boards. This product is a highly Conformable Release Film which, when exposed to heat and pressure, becomes extremely soft and pliable for superior conformance to intricate flex part topographies. PacoFlex contains no silicone or other additives that transfer to the Cover-Layer surface. The soft, heat-activatable, Hydraulic center is application-designed to reduce excessive "squeeze-out" and, effectively blocks adhesive or resin flow into unwanted areas.

• Total Elimination of Entrapped Air Between the Cover-Layer and the Circuitized Base Laminate.
• PacoFlex delivers discreet hydraulic force to reliably drive the Cover-Layer into complete side-wall conformance with the Circuitized Base Laminate.
• Finite Control of Adhesive Flow.
• Due to the optimized surface, and superior conformability, PacoFlex dams back acrylic and epoxy adhesives from flowing into Cover-Layer clearance areas.
• Quick, Easy Release.
• Both Sides of PacoFlex provide quick, easy, non-residue Release from all surfaces.
• Reduces Mechanical Distortion.
• PacoFlex "locks-in" around the Flexible components to minimize distortion due to Heat and Pressure.
• PacoFlex conforms closely to the part surface without excessive flow-out from the sheet. Deformed Circuits, Crushed Pads, and Glossy Pressure Spots are eliminated, resulting in repeatable Pad Registration.
• Reduced Lamination Pressure.
• PacoFlex, used with PacoPads® Pressure Diffuser Pads, delivers unmatched Z-axis pressure equalization. These two companion products conform and stabilize the Flexible components allowing the user to reduce the Hydraulic Force by up to 30%.